Schönox AP and APF are self-leveling compounds that can be poured over critical substrates, including wood subfloors, providing a smooth surface for installing a wide variety of laminate, vinyl, ceramic, and other floor coverings without the use of underlayment panels and boards.  “Our Schönox leveling compounds are great for use in new construction, but also in renovation projects where traditional demolition efforts can be costly and time consuming,” explained Russell Wright, HPS Schönox Regional Business Manager Southeast.  “Our products minimize demolition tasks and provide a subfloor that is sound, smooth, and ready for flooring installation.”
For more info please visit https://www.hpsubfloors.com.